I recently interviewed for an FPGA Engineer position at Samsung Research and Development (SRI-B) for a role requiring 2+ years…

Explore key challenges in PD for low power devices and discover effective solutions for power optimization, timing constraints, and thermal management in modern chip design.

Discover how signoff STA enhances timing analysis in chip design. Learn the key differences from traditional STA methods and why it’s crucial for modern IC development.

Learn how TCL Scripting in PD streamlines physical design workflows, automates repetitive tasks, and enhances productivity in VLSI design processes through custom commands and procedures.

Explore the essential EDA tools in PD that streamline IC design workflows. Learn about industry-standard software solutions for efficient physical design implementation

Explore the key manufacturing challenges and complexities of advanced nodes in semiconductor production, from design constraints to yield management in modern chip fabrication.

Discover how FinFET technology revolutionizes physical design in modern semiconductors. We explore the key advantages and challenges of implementing this innovative transistor architecture.

Discover how physical design for AI chips differs from traditional IC design approaches, including key considerations for power, performance, and area optimization in ML hardware

Explore the key challenges in 3D IC physical design, including TSV integration, thermal management, and design flow complexity. Learn how these impact semiconductor development.

Discover how multi-voltage design enables electronic devices to operate efficiently across different power sources. Learn implementation techniques and benefits for modern circuits.